CFD-ACE+ Multiphysics

CFD-ACE+（ Multiphysics based on Computational Fluid Dynamics ）

CFD-ACE+ の特徴の一つは，複数の物理モデルをシームレスに利用できる点です．例えば，誘導コイルを用いて加熱を行う熱CVD のシミュレーションを行うために，Flow・Heat・Chemistry・Radiation・Magnetic といった複数のモジュールを利用して成膜速度を計算することが可能です．また，得られた結果を元に，Stress モジュールを利用して熱応力解析への移行も容易です．

例えば，CVD（ Chemical Vapor Deposition ），PCVD（Plasma CVD），Dry Etching 等の基板処理技術，及び，触媒・改質といった表面処理技術のプロセス・装置設計に広く用いられている他，熱輻射，構造，電磁場，自由表面（VOF），及び，それらの組み合わせた解析が可能な一方で，電気浸透・電気泳動やミカエリス・メンテン式（ Michaelis-Menten kinetics ）に代表される酵素の反応速度式を取り扱うことも可能です．

以下，計算例をご紹介致します．

	■ シャワーヘッドの三次元シミュレーション（ Feb. 19 2012 ） (フィラメントモデルを利用)
	■ スライディンググリッドを使った移動体に対する誘導加熱（ May. 23 2011 ）
	■ ICP の非定常解析 : その2 （ Feb. 13 2011 ）
	■ ICP の放電開始から周期定常に至るまでの非定常解析（ Aug. 15 2010 ）
	■ CVD装置のテーパーを有するガスノズル形状の検討例（ April 30 2010 ）
	■ 流体構造連成（VOF + Stress）のシミュレーション（ Mar. 23 2010 ）
	■ 導入ガスを切り替える CVD装置の非定常ガス流れ解析（ Jan. 16 2010 ）
	■ モンテカルロ輻射モジュールを用いた熱解析（ Oct. 7 2009 ）　（Monte Carlo Radiation Module を利用）
	■ SiC CVD シミュレーションの計算例：その2 （ Aug. 17 2009 ）　（CVDSim の SiC edition を利用）
	■ 管内の液中高さ（メニスカス）の計算例（ May. 18 2009 ）　（mathematica での計算値と比較・検証）
	■ 密度の温度依存性を考慮した VOF の計算例（ May. 13 2009 ）
	■ メタンの白金触媒燃焼に関する計算例（ May. 5 2009 ）
	■ SiC CVD シミュレーションの計算例：その1 （ Feb. 12 2009 ）
	■ SiC CVD装置の熱解析の例を "論文から学ぶ - その2" に紹介（ Feb. 3 2009 ）
	■ ICPリアクタによる CF₄分解の計算例（ Jan. 30 2009 ）
	■ 誘電体バリア放電（DBD）の計算例（ Jan. 29 2009 ）
	■ GEC Reference Cell：CCP の計算例（ Jan. 23 2009 ）

■ 熱平衡モデルを利用した気相中の解析（ Door to Reaction Simulation に計算例を載せました： Jan. 18 2009 ）

■ 3次元ICPの計算例については，過去の論文[24]（マルチスパイラルコイルを用いた誘導結合型プラズマの 3 次元シミュレーション）をご参照下さい．

その他は，追ってご紹介致します．

以下では，CFD-ACE+ を用いている論文（適用例）をご紹介致します（分類は大まかなもので，あまり厳密ではありません）．なお，各論文の下の括弧内は，使用したと思われるモジュールです．

なお，当社の担当者が関係している論文・発表については，こちらをご覧下さい．

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■ 半導体業界やプラズマに関連の深い内容（References used CFD-ACE+ for mostly semiconductor industry）

熱CVD（ Thermal CVD ）

[SC1] Growth rate predictions of chemical vapor deposited silicon carbide epitaxial layers
Journal of Crystal Growth 243 (2002) 170-184
O. Danielsson, A. Henry, E. Janz!en
Linkoping University
(Flow, Heat, Radiation, Chemistry, Magnetic)

[SC2] Predicted nitrogen doping concentrations in silicon carbide epitaxial layers grown by hot-wall chemical vapor deposition
Journal of Crystal Growth 250 (2003) 471-478
O. Danielsson, U. Forsberg, E. Janz!en
Linkoping University
(Flow, Heat, Radiation, Chemistry, Magnetic)

[SC3] Reducing stress in silicon carbide epitaxial layers
Journal of Crystal Growth 252 (2003) 289-296
O. Danielsson, C. Hallin, E. Janzen
Linkoping University
(Flow, Heat, Radiation, Chemistry, Magnetic, Stress)

[SC4] Using N2 as precursor gas in III-nitride CVD growth
Journal of Crystal Growth 253 (2003) 26-37
O. Danielsson, E. Janzen
Linkoping University
(Flow, Heat, Radiation, Chemistry, Magnetic)

[SC5] Aluminum doping of epitaxial silicon carbide
Journal of Crystal Growth 253 (2003) 340-350
U. Forsberg, .O. Danielssona, A. Henrya, M.K. Linnarssonb, E. Janz!ena
Linkoping University, Royal Institute of Technology
(Flow, Heat, Radiation, Chemistry, Magnetic)

[SC6] NUMERICAL SIMULATION APPLIED TO CHEMICAL VAPOUR DEPOSITION PROCESS. RAPID THERMAL CVD AND SPRAY CVD
Journal of Optoelectronics and Advanced Materials Vol. 7, No. 2, April 2005, p. 599 - 606
A. Bouteville
ENSAM LPMI
(Flow, Heat, Chemistry, Radiation)

[SC7] Numerical Modeling for Heat Transfer, Chemical Reaction and Stress Field of SiC Sublimation Growth
Chang-Won Jeong, Kyung-Woo Yi, Soo-Hyung Seo, Myung-Hwan Oh
Seoul National University, NeosemiTech Corporation
(Flow, Heat, Chemistry, Magnetic, Stress)

プラズマ（ Etching, PCVD, DBD, DC, etc. ）

[SP1] Run-to-Run Control of Inductively Coupled C2F6 Plasma Etching of SiO2: Construction of a Numerical Process with a CFD Code
Seung Taek Seo, Kwang Soon Lee, Bum Kyoo Choi, Yong Hee Lee, Dae Rook Yang
Sogang University, Samsung Electronics, Korea University
(Flow, Chemistry, Plasma, Magnetic)

[SP2] Neutral uniformity and transport mechanisms for plasma etching
PHYSICS OF PLASMAS VOLUME 8, NUMBER 6 JUNE 2001
Seokmin Yuna, George R. Tynan, Vladimir Kolobov
University of California, CFD Research Corporation
(Flow, Chemistry, Plasma, Magnetic)

[SP3] Three Dimensional Simulations of Inductively Coupled Plasmas: A Filament Model
Applied Physics Letters May 2002
Vladimir Kolobov and Hui Ding
CFD Research Corporation
(Flow, Chemistry, Plasma, Electric, Magnetic)

[SP4] Two-dimensional simulations of the transition from Townsend to glow discharge and subnormal oscillations J. Phys. D: Appl. Phys. 36 (2003) 1-9
Robert R. Arslanbekov and Vladimir I. Kolobov
CFD Research Corporation
(Flow, Chemistry, Plasma, Electric, Kinetic)

[SP5] ATMOSPHERIC PRESSURE DC PLASMA MICRODISCHARGES: A CHARACTERIZATION STUDY
Proceedings of NHTC: National Heat Transfer Conference, July 21-23, 2003, Las Vegas, NV
Jeong W. Yi, Fang Yan, Bakhtier Farouk
Drexel University
(Flow, Chemistry, Plasma, Electric)

[SP6] Fokker-Planck modeling of electron kinetics in plasmas and semiconductors
Computational Materials Science 28 (2003) 302-320
Vladimir I. Kolobov
CFD Research Corporation
(Flow, Chemistry, Plasma, Electric, Magnetic, Kinetic)

[SP7] Substantiation of the Two-Temperature Kinetic Model by Comparing Calculations within the Kinetic and Fluid Models of the Positive Column Plasma of a DC Oxygen Discharge
Technical Physics, Vol. 48, No. 8, 2003, pp. 983-994
E. A. Bogdanov, A. A. Kudryavtsev, L. D. Tsendin, R. R. Arslanbekov, V. I. Kolobov, and V. V. Kudryavtsev
St. Petersburg State University, St. Petersburg State Technical University, CFD Research Corporation, CFD-Canada
(Flow, Chemistry, Plasma, Electric, Kinetic)

[SP8] Profiling and modeling of dc nitrogen microplasmas
JOURNAL OF APPLIED PHYSICS VOLUME 94, NUMBER 5 1 SEPTEMBER 2003
Chester G. Wilsona, Yogesh B. Gianchandani, Robert R. Arslanbekov, Vladimir Kolobov, Amy E. Wendt
University of Michigan, CFD Research Corporation, University of Wisconsin
(Flow, Chemistry, Plasma, Electric, Kinetic)

[SP9] Simulation of pulsed dielectric barrier discharge xenon excimer lamp
J. Phys. D: Appl. Phys. 37 (2004) 2987-2995
E A Bogdanov, A A Kudryavtsev, R R Arslanbekov and V I Kolobov
St Petersburg State University, CFD Research Corporation
(Flow, Chemistry, Plasma, Electric, Kinetic)

[SP10] Power consideration in the pulsed dielectric barrier discharge at atmospheric pressure
J. Appl. Phys., Vol. 96, No. 5, 1 September 2004
M. Laroussia, X. Lu, V. Kolobov, R. Arslanbekov
Old Dominion University, CFD Research Corporation
(Flow, Chemistry, Plasma, Electric, Kinetic)

[SP11] 2-D Simulations of Striations in Direct Current Glow Discharges in Argon
IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 33, NO. 2, APRIL 2005
Robert R. Arslanbekov and Vladimir I. Kolobov
CFD Research Corporation
(Flow, Chemistry, Plasma, Electric, Kinetic)

[SP12] Effects of showerhead shapes on the flowfields in a RF-PECVD reactor
Surface & Coatings Technology 193 (2005) 88-93
You-Jae Kim, Jin-Hyo Boo, Byungyou Hong, Youn J. Kim
SungKyunKwan University
(Flow, Heat, Chemistry)

フォトレジストの流れ解析 ( Photoresist flow ）

[SR1] Photoresist flow simulation using the viscous flow model
(0-7803-7826-1/03/$17.00 2003 IEEE)
Won-Young Chung, Tai-Kyung Kim, Young-Tae Kim, Byung-Joon Hwang, Young-Kwan Park, and Jeong-Taek Kong
Samsung Electronics
(Flow, VOF)

[SR2] Simulation of Photoresist Thermal Flow Process with Viscous Flow Model
Japanese Journal of Applied Physics Vol. 43, No. 9A, 2004, pp. 6020-6025
Won-Young CHUNG, Tai-Kyung KIM, Yero LEE, Jin-Young YOON, Hyun-Woo KIM, Young-Kwan PARK, Jeong-Taek KONG
Samsung Electronics
(Flow, Heat, VOF)

その他（半導体関連）

[S1] Spatial distribution of resistive intergranular phase in stabilized zirconia estimated by millicontact impedance spectroscopy
Journal of the European Ceramic Society 24 (2004) 1129-1133
Jong-Heun Lee a, Young-Soo Junga, Hyo-Sang Woob, Yong-Chae Chungb, Doh-Yeon Kima
Seoul National University
(Flow, Electric, Magnetic)

[S2] Optimal Design of an Energy Efficient Vacuum Furnace Using Thermal Analysis Database
Min-Ji Kim, Ho-Girl Jung, Jae-Woo Lee, Changjin Lee and Yung-Hwan Byun
Konkuk University

[S3] Solving Electric Field in Combined Conductor and Dielectric Devices
NSTI-Nanotech 2006, www.nsti.org, ISBN 0-9767985-6-5 Vol. 1, 2006
Z.J. Chen, A. Przekwas, M. Athavale, N. Zhou
CFD Research Corporation, GE Power, ESI group
(Flow, Electric）

[S4] Optimal Design of Water Jet Nozzles Utilizing Independence Design Axiom
Hyunsuk Shin and Jongsoo Lee
Yonsei University
(Flow, Turbulence, Cavitation)
note：このジェットノズルは，LCD のクリーニングに関係するものです

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■ VOF（自由表面）に関連の深い内容（References used CFD-ACE+ for VOF/Free Surface）

VOF ( microfluidics ）

[VM1] Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of IC Components
1997 Electronic Components and Technology Conference, pp. 158-167
H. Q. Yang, S. A. Bayyuk, L. T. Nguyen
CFD Research Corporation, National Semiconductor Corporation
(Flow, VOF, Stress)

[VM2] CFD-ACE+MEMS : A CAD system for simulation and modeling of MEMS
Symposium on Design, Test, and Microfabrication of MEMs/MOEMs V. 3680, Paris, France 1999
Phillip Stout, H. Q. Yang, Paul Dionne, Andy Leonard, Zhiqiang Tan, Andrzej Przekwas, Anantha Krishnan
CFD Research Corp
(Flow, Heat, VOF, Stress, Electric, Magnetic)

[VM3] Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of Electronic Components
Journal of Pressure Vessel Technology, NOVEMBER 2001, Vol. 123
H.-Q. Yang, S. Bayyuk, S. Mazumder, S. Lowry, A. Krishnan, A. Przekwas, L. Nguyen
CFD Research Corporation, National Semiconductor Corporation
(Flow, VOF, Stress)

[VM4] Computational Design of Membrane Pumps with Active/Passive Valves for Microfluidic MEMS
A.J. Przekwas, H.Q. Yang, M.M. Athavale
CFD Research Corp
(Flow, Heat, VOF, Stress, Electric)

[VM5] An Integrated Multidisciplinary CAD/CAE Environment for Micro-Electro-Mechanical Systems (MEMS)
MEMS, microfluidics, CAD, multi-disciplinary design
Andrzej Przekwas
CFD Research Corp
(Flow, Heat, VOF, Stress)

[VM6] Effect of LVAD Outflow Conduit Insertion Angle on Flow through the Native Aorta
Karen D. May-Newman, Brian K. Hillen, Christopher S. Sironda, Walter Dembitsky
San Diego State University, Sharp Memorial Hospital
(Flow, VOF, Stress)

[VM7] Electrical discharge in capillary breakup: controlling the charge of a droplet
Jean-Christophe Baret, Frieder Mugele
Philips Research Laboratories Eindhoven, University of Twente
(Flow, Chemistry, VOF, Electric)

[VM8] Bubbles in Microchannels
Mads Jakob Jensen
Technical University of Denmark
(Flow, VOF)

[VM9] Thermal Bubble Jet Printhead with Integrated Nozzle Plate
T. Lindemann, R. Zengerle, P. Koltay, H. Ashauer, T. Goettsche, H. Sandmaier, Y. Yu, R.-P. Peters, D. Sassano, A. Bellone, A. Scardovi
IMTEK, HSG-IMIT, STEAG, Olivetti I-Jet
(Flow, Heat, VOF)

[VM10] Frequency-Dependent Transversal Flow Control In Centrifugal Microfluidics
Thilo Brenner, Thomas Glatzel, Roland Zengerle, and Jens Ducree
IMTEK
(Flow, VOF)

[VM11] Flow Behavior at the Embossing Stage of Nanoimprint Lithography
Fibers and Polymers 2002, Vol.3, No.3, 00-00
Jun-Ho Jeong, Youn-Suk Choi, Young-Jae Shin, Jae-Jong Lee, Kyoung-Taik Park, Eung-Sug Lee, Sang-Rok Lee
Korea Institute of Machinery and Materials, KyungWon Tech Corporation
(Flow, VOF)

[VM12] Fixed-volume metering microdispenser module
Lab Chip, 2002, 2, 213-218
Aniruddha Puntambekar, Jin-Woo Choi, Chong H. Ahn, Vinod Makhijani, Sura Kim
University of Cincinnati , CFD Research Corporation
(Flow, VOF)

[VM13] Controlled Fission of Droplet Emulsion in Bifurcating Microfluidic Channels
The 12th International Conference on Solid State Sensors, Actuators and Microsystems, Boston, June 8-12, 2003
Yung-Chieh Tana, John Collins, and Abraham P. Lee
University of California
(Flow, VOF)

[VM14] Dispensing Well Plate (DWP): A Highly Integrated Nanoliter Dispensing System
The 12th International Conference on Solid State Sensors, Actuators and Microsystems, Boston, June 8-12, 2003
Peter Koltay, Benjamin Bohl, Salah Taoufik, Reinhard Steger, Roland Zengerle, Stephan Messnerb, Hermann Sandmaierb
IMTEK, HSG-IMIT
(Flow, VOF)

[VM15] Massively Parallel Multi-Tip Nanoscale Writer with Fluidic Capabilities - Fountain Pen Nanolithography (FPN)
Proceedings of the 4th International Symposium on MEMS and Nanotechnology, the 2003 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 2-4, Charlotte, North Carolina, Session 52, Paper 191, pp. 235-238, 2003
K.-H. Kim, C. Ke, N. Moldovan and H.D. Espinosa
Northwestern University
(Flow, VOF)

[VM16] Disposable Smart Lab on a Chip for Point-of-Care Clinical Diagnostics
IEEE, VOL. 92, NO. 1, JANUARY 2004
Jeong-Bong Lee, JaeY. Lee Joseph H. Nevin, Chong H. Ahn, Gregory Beaucage and Aniruddha P. Puntambekar, Jin-Woo Choi
University of Texas at Dallas, Ohio State University, University of Cincinnati, Louisiana State University
(Flow, Heat, VOF)

[VM17] Theoretical evaluation of the dispensing well plate method (DWP part II)
Sensors and Actuators A, 2004
Peter Koltay, Jan Kalix, Roland Zengerle
IMTEK
(Flow, VOF)

[VM18] PipeJet - A simple disposable dispenser for the nano- and microliter range
Elsevier Editorial(tm) for Journal of the Association for Laboratory
W. Streule, T. Lindemann, G. Birkle, R. Zengerle, P. Koltay
IMTEK
(Flow, VOF)

[VM19] Improved Gas Bubble Mobility in Chic-Type Flow Channels
ACTUATOR 2004, 9th International Conference on New Actuators, 14-16 June 2004, Bremen, Germany
C. Litterst, R. Zengerle, P. Koltay, J. Kohnle, H. Ernst, S. Messner, H. Sandmaier
IMTEK, HSG-IMIT
(Flow, VOF)

[VM20] Three-Dimensional CFD-Simulation of a Thermal Bubble Jet Printhead
NSTI-Nanotech 2004, www.nsti.org, ISBN 0-9728422-8-4 Vol. 2, 2004
T. Lindemann, R. Zengerle, P. Koltay, D. Sassano, A. Bellone
IMTEK, Olvetti I-Jet
(Flow, VOF)

[VM21] A Novel AFM Chip for Fountain Pen Nanolithography - Design and Microfabrication
Mat. Res. Soc. Symp. Proc. Vol. 782, 2004 Materials Research Society A5.56.1
Keun-Ho Kim, Nicolaie Moldovan, Changhong Ke, Horacio D. Espinosa
Northwestern University
(Flow, VOF)

[VM22] A Computational Model for the Design of ElectroWetting On Dielectric (EWOD) Systems
NSTI-Nanotech 2005, www.nsti.org, ISBN 0-9767985-0-6 Vol 1, 2005
A.S. Bedekar, J.W. Jenkins, S. Sundaram
CFD Research Corporation
(Flow, Chemistry, VOF)

[VM23] Towards Numerical Prototyping of Labs-on-chip: Modeling for Integrated Microfluidic Devices
Microfluid Nanofluid (2005) 1: 301-318
David Erickson
Cornell University
(Flow, Chemistry, VOF)

[VM24] Cell Stimulus and Lysis in a Microfluidic Device with Segmented Gas-Liquid Flow
Analytical Chemistry, Vol. 77, No. 11, June 1, 2005, pp. 3629-3636
Jamil El-Ali, Axel Gu1 nther, Klavs F. Jensen, Suzanne Gaudet, Peter K. Sorger
Massachusetts Institute of Technology
(Flow, Heat, VOF)

[VM25] Analysis of the Droplet Ejection for Piezoelectric-driven Industrial Inkjet Head
NSTI-Nanotech 2006, www.nsti.org, ISBN 0-9767985-7-3 Vol. 2, 2006
Wonchul Sim, Sung-Jun Park, Changsung Park, Youngseuck Yoo, Youngjae Kim, Jaewoo Joung, Yongsoo Oh
Samsung Electro-Mechanics Co. Ltd
(Flow, VOF)

[VM26] Computational Fluid Dynamics (CFD) Software Tools for Microfluidic Applications - A Case Study
Computers & Fluids 37 (2008) 218-235
Thomas Glatzel, Christian Litterst, Claudio Cupelli, Timo Lindemann, Christian Moosmann, Remigius Niekrawietz, Wolfgang Streule, Roland Zengerle, Peter Koltay
IMTEK, University of Freiburg
(Flow, Chemistry, VOF, User Define Scalar)

VOF ( biomedical )

[VB1] Microfluidic Filtration Chip for DNA Extraction and Concentration
Agata Przekwas, DeMing Wang, Vinod B. Makhijani, Andrzej J. Przekwas
CFD Research Corporation
(Flow, Heat, Chemistry, VOF, Electric)

VOF with Chemistry ( catalytic converter, reforming etc. )

[VC1] Sub-Grid Scale Modeling of Heterogeneous Chemical Reactions and Transport in Full-Scale Catalytic Converters
COMBUSTION AND FLAME 131:85-97 (2002)
Sandip Mazumder, Debasis Sengupta
CFD Research Corporation
(Flow, Heat, Chemistry, VOF)

[VC2] Rigorous Three-Dimensional Mathematical Modeling of Proton Exchange Membrane Fuel Cells Part 1: Model Predictions Without Liquid Water Transport
Sandip Mazumder, James Vernon Cole
CFD Research Corporation
(Flow, Heat, Chemistry, VOF, Electric)

[VC3] Optimization of methane reforming in a microreactor effects of catalyst loading and geometry
Chemical Engineering Science 61 (2006) 4027-4040
Michael J. Stutz, Nico Hotz, Dimos Poulikakos
ETH Zurich
(Flow, Heat, Chemistry, VOF, Electric)

[VC4] A Numerical Spray Impingement Model Coupled With A Free Surface Film Model
Vernon Cole, Sam Lowry, Deepak Mehra, Donald Gray
CFD Research Corporation West Virgina University
(Flow, VOF, Spray)

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■ その他の応用例については，追って整理してご紹介する予定です．

☆

update :

< Jan. 24 2009 > addition of paper list regarding VOF ( Free Surface )
< Jan. 22 2009 > addition of paper list for mostly semiconductor industry

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